@article{DresbachLorenzPetzoldetal.2011, author = {Christian Dresbach and Georg Lorenz and Matthias Petzold and Holm Altenbach}, title = {Analysis of Chip Damage Risk in Thermosonic Wire Bonding}, series = {Key Engineering Materials}, volume = {478}, publisher = {Trans Tech Publications}, issn = {1662-9795}, doi = {10.4028/www.scientific.net/KEM.478.75}, pages = {75 -- 80}, year = {2011}, language = {en} }