@article{DresbachLorenzPetzoldetal.2011,
  author    = {Christian Dresbach and Georg Lorenz and Matthias Petzold and Holm Altenbach},
  title     = {Analysis of Chip Damage Risk in Thermosonic Wire Bonding},
  series   = {Key Engineering Materials},
  volume    = {478},
  publisher = {Trans Tech Publications},
  issn      = {1662-9795},
  doi       = {10.4028/www.scientific.net/KEM.478.75},
  pages     = {75 -- 80},
  year      = {2011},
  language  = {en}
}