@article{DresbachLorenzPetzoldetal.2011, author = {Dresbach, Christian and Lorenz, Georg and Petzold, Matthias and Altenbach, Holm}, title = {Analysis of Chip Damage Risk in Thermosonic Wire Bonding}, journal = {Key Engineering Materials}, volume = {478}, issn = {1662-9795}, doi = {10.4028/www.scientific.net/KEM.478.75}, pages = {75 -- 80}, year = {2011}, language = {en} }