TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Petzold, M.
A1  - Dresbach, C.
A1  - Ebert, M.
A1  - Bagdahn, J.
A1  - Wiemer, M.
A1  - Glien, K.
A1  - Graf, J.
A1  - Muller-Fiedler, R.
A1  - Hofer, H.
T1  - Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
T2  - Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. 30 May - 02 June 2006, San Diego, CA, USA
KW  - fracture toughness
KW  - crack growth
KW  - reliability
KW  - micro chevron
SN  - 0-7803-9524-7
SB  - 0-7803-9524-7
U6  - https://doi.org/10.1109/ITHERM.2006.1645501
DO  - https://doi.org/10.1109/ITHERM.2006.1645501
SP  - 1343
EP  - 1348
S1  - 6
PB  - IEEE
ER  -