TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Dresbach, C.
A1  - Mittag, M.
A1  - Petzold, M.
A1  - Milke, E.
A1  - Müller, T.
T1  - Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
T2  - 2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini
KW  - wire bonding
KW  - Hall-Petch relation
KW  - indentation
KW  - micro compression test
KW  - aluminum
KW  - EBSD
UR  - https://ieeexplore.ieee.org/document/5272862
SN  - 978-1-4244-4722-0
SB  - 978-1-4244-4722-0
PB  - IEEE
ER  -