TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Dresbach, C.
A1  - Mittag, M.
A1  - Petzold, M.
T1  - Elastic properties of bonding wires
T2  - 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany
SN  - 978-1-4244-8555-0
SB  - 978-1-4244-8555-0
U6  - https://doi.org/10.1109/ESTC.2010.5642992
DO  - https://doi.org/10.1109/ESTC.2010.5642992
SP  - 1
EP  - 4
S1  - 4
PB  - IEEE
ER  -