TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Lorenz, G.
A1  - Petzold, M.
A1  - Mittag, M.
A1  - Dresbach, C.
A1  - Milke, E.
T1  - Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
T2  - 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany
SN  - 978-1-4244-8555-0
SB  - 978-1-4244-8555-0
U6  - https://doi.org/10.1109/ESTC.2010.5642816
DO  - https://doi.org/10.1109/ESTC.2010.5642816
SP  - 1
EP  - 6
S1  - 6
PB  - IEEE
ER  -