TY  - JOUR
U1  - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed)
A1  - Dresbach, Christian
A1  - Lorenz, Georg
A1  - Petzold, Matthias
A1  - Altenbach, Holm
T1  - Analysis of Chip Damage Risk in Thermosonic Wire Bonding
JF  - Key Engineering Materials
SN  - 1662-9795
SS  - 1662-9795
U6  - https://doi.org/10.4028/www.scientific.net/KEM.478.75
DO  - https://doi.org/10.4028/www.scientific.net/KEM.478.75
VL  - 478
SP  - 75
EP  - 80
S1  - 6
PB  - Trans Tech Publications
ER  -