TY - CPAPER U1 - Konferenzveröffentlichung A1 - Nötzold, K. A1 - Dresbach, C. A1 - Graf, J. A1 - Böttge, B. T1 - Temperature dependent fracture toughness of glass frit bonding layers T2 - Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 1-3 April 2009, Rome, Italy Y1 - 2009 UR - https://ieeexplore.ieee.org/abstract/document/4919527 SN - 978-1-4244-3874-7 SB - 978-1-4244-3874-7 PB - IEEE ER -