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Curing behavior and reaction kinetics of binder resins for 3D-printing investigated by dielectric analysis (DEA)

  • 3D-Printing is an efficient method in the field of additive manufacturing. In order to optimize the properties of manufactured parts it is essential to adapt the curing behavior of the resin systems with respect to the requirements. Thus, effects of resin composition, e.g. due to different additives such as thickener and curing agents, on the curing behavior have to be known. As the resin transfers from a liquid to a solid glass the time dependent ion viscosity was measured using DEA with flat IDEX sensors. This allows for a sensitive measurement of resin changes as the ion viscosity changes two to four decades. The investigated resin systems are based on the monomers styrene and HEMA. To account for the effects of copolymerization in the calculation of the reaction kinetics it was assumed that the reaction can be considered as a homo-polymerization having a reaction order n?1. Then the measured ion viscosity curves are fitted with the solution of the reactions kinetics - the time dependent degree of conversion (DC-function) - for times exceeding the initiation phase representing the primary curing. The measured ion viscosity curves can nicely be fitted with the DC-function and the determined fit parameters distinguish distinctly between the investigated resin compositions.

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Metadaten
Document Type:Conference Object
Language:English
Author:B. Möginger, L. Kehret, B. Hausnerova, J. Steinhaus
Parent Title (English):VIII International Conference on "Times of Polymers and Composites": From Aerospace to Nanotechnology. Naples, Italy, 19-23 June 2016. AIP Conf. Proc., Vol. 1736
First Page:020074
ISBN:978-0-7354-1390-0
DOI:https://doi.org/10.1063/1.4949649
Publisher:AIP Publishing
Publication year:2016
Tag:curing behavior; dielectric analysis; ion viscosity; reaction kinetics; resin for 3D-printing
Departments, institutes and facilities:Fachbereich Angewandte Naturwissenschaften
Institut für Technik, Ressourcenschonung und Energieeffizienz (TREE)
Entry in this database:2016/05/30