Local Hardening Behavior of Free Air Balls and Heat Affected Zones of Thermosonic Wire Bond Interconnections
Document Type: | Conference Object |
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Language: | English |
Author: | C. Dresbach, G. Lorenz, M. Mittag, M. Petzold, E. Milke, T. Müller |
Parent Title (English): | 2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini |
ISBN: | 978-1-4244-4722-0 |
URL: | https://ieeexplore.ieee.org/document/5272861 |
Publisher: | IEEE |
Date of first publication: | 2009/09/29 |
Keyword: | EBSD; capillary compression test; gold; wire bonding |
Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
Entry in this database: | 2022/04/14 |