Mechanical properties of glass frit bonded micro packages
| Document Type: | Article |
|---|---|
| Language: | English |
| Author: | C. Dresbach, A. Krombholz, M. Ebert, J. Bagdahn |
| Parent Title (English): | Microsystem Technologies |
| Volume: | 12 |
| Issue: | 5 |
| Number of pages: | 8 |
| First Page: | 473 |
| Last Page: | 480 |
| ISSN: | 0946-7076 |
| DOI: | https://doi.org/10.1007/s00542-005-0031-9 |
| Publisher: | Springer |
| Date of first publication: | 2005/10/28 |
| Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Entry in this database: | 2022/04/14 |
