Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
| Document Type: | Conference Object |
|---|---|
| Language: | English |
| Author: | M. Petzold, C. Dresbach, M. Ebert, J. Bagdahn, M. Wiemer, K. Glien, J. Graf, R. Muller-Fiedler, H. Hofer |
| Parent Title (English): | Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. 30 May - 02 June 2006, San Diego, CA, USA |
| Number of pages: | 6 |
| First Page: | 1343 |
| Last Page: | 1348 |
| ISBN: | 0-7803-9524-7 |
| DOI: | https://doi.org/10.1109/ITHERM.2006.1645501 |
| Publisher: | IEEE |
| Date of first publication: | 2006/07/05 |
| Keywords: | crack growth; fracture toughness; micro chevron; reliability |
| Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Entry in this database: | 2022/04/14 |
