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Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors

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Metadaten
Document Type:Conference Object
Language:English
Author:M. Petzold, C. Dresbach, M. Ebert, J. Bagdahn, M. Wiemer, K. Glien, J. Graf, R. Muller-Fiedler, H. Hofer
Parent Title (English):Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. 30 May - 02 June 2006, San Diego, CA, USA
Number of pages:6
First Page:1343
Last Page:1348
ISBN:0-7803-9524-7
DOI:https://doi.org/10.1109/ITHERM.2006.1645501
Publisher:IEEE
Date of first publication:2006/07/05
Keyword:crack growth; fracture toughness; micro chevron; reliability
Dewey Decimal Classification (DDC):6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Entry in this database:2022/04/14