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Temperature dependent fracture toughness of glass frit bonding layers

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Metadaten
Document Type:Conference Object
Language:English
Author:K. Nötzold, C. Dresbach, J. Graf, B. Böttge
Parent Title (English):Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 1-3 April 2009, Rome, Italy
ISBN:978-1-4244-3874-7
URL:https://ieeexplore.ieee.org/abstract/document/4919527
Publisher:IEEE
Date of first publication:2009/05/12
Dewey Decimal Classification (DDC):6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Entry in this database:2022/04/14