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Local Hardening Behavior of Free Air Balls and Heat Affected Zones of Thermosonic Wire Bond Interconnections

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Metadaten
Document Type:Conference Object
Language:English
Author:C. Dresbach, G. Lorenz, M. Mittag, M. Petzold, E. Milke, T. Müller
Parent Title (English):2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini
ISBN:978-1-4244-4722-0
URL:https://ieeexplore.ieee.org/document/5272861
Publisher:IEEE
Date of first publication:2009/09/29
Keyword:EBSD; capillary compression test; gold; wire bonding
Dewey Decimal Classification (DDC):6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Entry in this database:2022/04/14