Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
| Document Type: | Conference Object |
|---|---|
| Language: | English |
| Author: | G. Lorenz, M. Petzold, M. Mittag, C. Dresbach, E. Milke |
| Parent Title (English): | 3rd Electronic System-Integration Technology Conference ESTC, 13-16 Sept. 2010, Berlin, Germany |
| Number of pages: | 6 |
| First Page: | 1 |
| Last Page: | 6 |
| ISBN: | 978-1-4244-8555-0 |
| DOI: | https://doi.org/10.1109/ESTC.2010.5642816 |
| Publisher: | IEEE |
| Date of first publication: | 2010/11/22 |
| Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Entry in this database: | 2022/04/14 |
