Analysis of Chip Damage Risk in Thermosonic Wire Bonding
Document Type: | Article |
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Language: | English |
Author: | Christian Dresbach, Georg Lorenz, Matthias Petzold, Holm Altenbach |
Parent Title (English): | Key Engineering Materials |
Volume: | 478 |
Number of pages: | 6 |
First Page: | 75 |
Last Page: | 80 |
ISSN: | 1662-9795 |
DOI: | https://doi.org/10.4028/www.scientific.net/KEM.478.75 |
Publisher: | Trans Tech Publications |
Date of first publication: | 2011/04/01 |
Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
Entry in this database: | 2022/04/14 |