Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
| Document Type: | Conference Object |
|---|---|
| Language: | English |
| Author: | C. Dresbach, M. Mittag, M. Petzold, E. Milke, T. Müller |
| Parent Title (English): | 2009 European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini |
| ISBN: | 978-1-4244-4722-0 |
| URL: | https://ieeexplore.ieee.org/document/5272862 |
| Publisher: | IEEE |
| Date of first publication: | 2009/09/29 |
| Keywords: | EBSD; Hall-Petch relation; aluminum; indentation; micro compression test; wire bonding |
| Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Entry in this database: | 2022/04/14 |
