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Integrating Bond Graph-Based Fault Diagnosis and Fault Accommodation Through Inverse Simulation
(2017)
Incremental Bond Graphs
(2011)
Bond graph software can simulate bond graph models without the user needing to manually derive equations. This offers the power to model larger and more complex systems than in the past. Multibond graphs (those with vector bonds) offer a compact model which further eases handling multibody systems. Although multibond graphs can be simulated successfully, the use of vector bonds can present difficulties. In addition, most qualitative, bond graph–based exploitation relies on the use of scalar bonds. This article discusses the main methods for simulating bond graphs of multibody systems, using a graphical software platform. The transformation between models with vector and scalar bonds is presented. The methods are then compared with respect to both time and accuracy, through simulation of two benchmark models. This article is a tutorial on the existing methods for simulating three-dimensional rigid and holonomic multibody systems using bond graphs and discusses the difficulties encountered. It then proposes and adapts methods for simulating this type of system directly from its bond graph within a software package. The value of this study is in giving practical guidance to modellers, so that they can implement the adapted method in software.
Failure prognostic builds up on constant data acquisition and processing and fault diagnosis and is an essential part of predictive maintenance of smart manufacturing systems enabling condition based maintenance, optimised use of plant equipment, improved uptime and yield and to prevent safety problems. Given known control inputs into a plant and real sensor outputs or simulated measurements, the model-based part of the proposed hybrid method provides numerical values of unknown parameter degradation functions at sampling time points by the evaluation of equations that have been derived offline from a bicausal diagnostic bond graph. These numerical values are computed concurrently to the constant monitoring of a system and are stored in a buffer of fixed length. The data-driven part of the method provides a sequence of remaining useful life estimates by repeated projection of the parameter degradation into the future based on the use of values in a sliding time window. Existing software can be used to determine the best fitting function and can account for its random parameters. The continuous parameter estimation and their projection into the future can be performed in parallel for multiple isolated simultaneous parametric faults on a multicore, multiprocessor computer.
The proposed hybrid bond graph model-based, data-driven method is verified by an offline simulation case study of a typical power electronic circuit. It can be used to implement embedded systems that enable cooperating machines in smart manufacturing to perform prognostic themselves.
This book shows in a comprehensive presentation how Bond Graph methodology can support model-based control, model-based fault diagnosis, fault accommodation, and failure prognosis by reviewing the state-of-the-art, presenting a hybrid integrated approach to Bond Graph model-based fault diagnosis and failure prognosis, and by providing a review of software that can be used for these tasks.
Analytical redundancy relations are fundamental in model-based fault detection and isolation. Their numerical evaluation yields a residual that may serve as a fault indicator. Considering switching linear time-invariant system models that use ideal switches, it is shown that analytical redundancy relations can be systematically deduced from a diagnostic bond graph with fixed causalities that hold for all modes of operation. Moreover, as to a faultless system, the presented bond graph–based approach enables to deduce a unique implicit state equation with coefficients that are functions of the discrete switch states. Devices or phenomena with fast state transitions, for example, electronic diodes and transistors, clutches, or hard mechanical stops are often represented by ideal switches which give rise to variable causalities. However, in the presented approach, fixed causalities are assigned only once to a diagnostic bond graph. That is, causal strokes at switch ports in the diagnostic bond graph reflect only the switch-state configuration in a specific system mode. The actual discrete switch states are implicitly taken into account by the discrete values of the switch moduli. The presented approach starts from a diagnostic bond graph with fixed causalities and from a partitioning of the bond graph junction structure and systematically deduces a set of equations that determines the wanted residuals. Elimination steps result in analytical redundancy relations in which the states of the storage elements and the outputs of the ideal switches are unknowns. For the later two unknowns, the approach produces an implicit differential algebraic equations system. For illustration of the general matrix-based approach, an electromechanical system and two small electronic circuits are considered. Their equations are directly derived from a diagnostic bond graph by following causal paths and are reformulated so that they conform with the matrix equations obtained by the formal approach based on a partitioning of the bond graph junction structure. For one of the three mode-switching examples, a fault scenario has been simulated.
Bond graph modelling
(2006)