Analysis of Chip Damage Risk in Thermosonic Wire Bonding
| Document Type: | Article |
|---|---|
| Language: | English |
| Author: | Christian Dresbach, Georg Lorenz, Matthias Petzold, Holm Altenbach |
| Parent Title (English): | Key Engineering Materials |
| Volume: | 478 |
| Number of pages: | 6 |
| First Page: | 75 |
| Last Page: | 80 |
| ISSN: | 1662-9795 |
| DOI: | https://doi.org/10.4028/www.scientific.net/KEM.478.75 |
| Publisher: | Trans Tech Publications |
| Date of first publication: | 2011/04/01 |
| Dewey Decimal Classification (DDC): | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Entry in this database: | 2022/04/14 |
